发明名称 INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE
摘要 The insulation paste of the present invention contains (a) a glass powder, and (b) an organic solvent, wherein one or both of alumina (Al203) and titanium oxide (TiO2) are contained in the paste as a glass diffusion inhibitor, and the content of this glass diffusion inhibitor is 12 to 50% by weight based on the content of inorganic component in the paste.
申请公布号 US2010200283(A1) 申请公布日期 2010.08.12
申请号 US20100768202 申请日期 2010.04.27
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 INABA AKIRA;HAMAGUCHI MASAKI;NAKAJIMA NAOTO
分类号 H05K1/00;H05K3/00 主分类号 H05K1/00
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