发明名称
摘要 PROBLEM TO BE SOLVED: To be able to press a bonding object with an appropriate load against a bonded substance and to improve the property of the bonding substance against the bonded object by the means. SOLUTION: A bonding means continuously increases and decreases a bonding load during the bonding.
申请公布号 JP4521099(B2) 申请公布日期 2010.08.11
申请号 JP20000163448 申请日期 2000.05.31
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址