| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is constituted so that the boundary between different kinds of materials may not be exposed to the outside, and to provide a method of manufacturing the device. <P>SOLUTION: The semiconductor device 10A is provided with a semiconductor element 11 provided with external electrodes 14 on its bottom surface, and a sealing resin 12 which covers the semiconductor element 11 in a state that the external electrodes 14 are exposed. An electric circuit is formed on the surface of the semiconductor element 11, and the external electrodes 14 are formed on the rear surface of the element 11. The electric circuit and the external electrodes 14 formed on the surfaces of the element 11 are electrically connected to each other via through electrodes 13. The electrodes 13 are formed through the element 11 in the thickness direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
