MULTI-CHIP DEVICES HAVING CONDUCTIVE VIAS

摘要

PURPOSE: A multichip device including conductive-vias is provided to form a stacked package by arranging a plurality of chips on signaling wires, which includes via-contacts, into stair shapes. CONSTITUTION: Signaling wires(180) include via-contacts(160). A plurality of chips(S1 to S4) is arranged on the signaling wires into a stair shape. Chip pads(P1 to P4) are formed on one side of each chip. A packaging mold(135) seals a plurality of chips. Conductive-vias(V1 to V4) are formed by passing through the packaging mold. The conductive-vias electrically connect one of the chip pads and one of the via-contacts.