发明名称 |
Semiconductor die package and method for making the same |
摘要 |
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. |
申请公布号 |
US7772681(B2) |
申请公布日期 |
2010.08.10 |
申请号 |
US20060471291 |
申请日期 |
2006.06.19 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
JOSHI RAJEEV;WU CHUNG-LIN;IYER VENKAT |
分类号 |
H01L0021/000495 |
主分类号 |
H01L0021/000495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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