发明名称 |
Dynamic pad size to reduce solder fatigue |
摘要 |
A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
|
申请公布号 |
US7772104(B2) |
申请公布日期 |
2010.08.10 |
申请号 |
US20070701651 |
申请日期 |
2007.02.02 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
PHAM TIM V.;UEHLING TRENT S. |
分类号 |
H01L21/44;H01L29/40 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|