发明名称 Laser system and method for non-destructive bond detection and evaluation
摘要 A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
申请公布号 US7770454(B2) 申请公布日期 2010.08.10
申请号 US20040950865 申请日期 2004.09.27
申请人 LSP TECHNOLOGIES, INC. 发明人 SOKOL DAVID W.;WALTERS CRAIG T.;DULANEY JEFF L.;TOLLER STEVEN M.
分类号 G01N29/04;G01N29/24 主分类号 G01N29/04
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