发明名称 |
Method of forming film pattern, film pattern, device, electro optic device, and electronic apparatus |
摘要 |
A method of forming a film pattern by placing a functional liquid on a substrate, comprises: forming a bank on the substrate, wherein the bank corresponds to a region for forming the film pattern; placing the functional liquid in the region for forming the film pattern partitioned by the bank; and curing the functional liquid to form the film pattern; wherein the functional liquid is placed under conditions that a difference between an advancing contact angle and a receding contact angle of the functional liquid with a top surface of the bank is 10 degrees or more and that the receding contact angle is 13 degrees or more.
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申请公布号 |
US7771246(B2) |
申请公布日期 |
2010.08.10 |
申请号 |
US20060382555 |
申请日期 |
2006.05.10 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HIRAI TOSHIMITSU;MORIYA KATSUYUKI;SAKAI SHINRI |
分类号 |
H01J9/00;H01J1/62 |
主分类号 |
H01J9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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