发明名称 Method of forming film pattern, film pattern, device, electro optic device, and electronic apparatus
摘要 A method of forming a film pattern by placing a functional liquid on a substrate, comprises: forming a bank on the substrate, wherein the bank corresponds to a region for forming the film pattern; placing the functional liquid in the region for forming the film pattern partitioned by the bank; and curing the functional liquid to form the film pattern; wherein the functional liquid is placed under conditions that a difference between an advancing contact angle and a receding contact angle of the functional liquid with a top surface of the bank is 10 degrees or more and that the receding contact angle is 13 degrees or more.
申请公布号 US7771246(B2) 申请公布日期 2010.08.10
申请号 US20060382555 申请日期 2006.05.10
申请人 SEIKO EPSON CORPORATION 发明人 HIRAI TOSHIMITSU;MORIYA KATSUYUKI;SAKAI SHINRI
分类号 H01J9/00;H01J1/62 主分类号 H01J9/00
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