发明名称 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing
摘要 Embodiments of the invention describe electrical contacts for integrated circuits and methods of forming using gas cluster ion beam (GCIB) processing. The electrical contacts contain a fused metal-containing layer formed by exposing a patterned structure to a gas cluster ion beam containing a transition metal precursor or a rare earth metal precursor.
申请公布号 US7772110(B2) 申请公布日期 2010.08.10
申请号 US20070864334 申请日期 2007.09.28
申请人 TOKYO ELECTRON LIMITED 发明人 ROBISON RODNEY L.;TRICKETT DOUGLAS
分类号 H01L21/4763 主分类号 H01L21/4763
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