METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR

摘要

PURPOSE: A method and a structure thereof are provided to reduce manufacturing costs by implementing a clean available copper surface where a solder is adhered. CONSTITUTION: A lead frame(16) with leadframe leads(12) is buried inside a mold composite. At least one part of the leadframe lead is exposed. A conductive material(40) is formed on the exposed part. The conductive material is barrel-pated on the exposed part. A mold composite is separated in order to form singulated semiconductor devices.