| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyester film suitable as a support for forming filmy interlayer insulating material which is used for a multilayer printed circuit board manufactured by the buildup method for corresponding to micro-fabrication or high density of wiring. SOLUTION: The polyester film for the support for forming an interlayer dielectric is the polyester film for use as the support for coating a thermosetting resin forming the interlayer dielectric, wherein an amount of film surface oligomer (cyclic trimer) upon heat treatment at 180°C for 10 minutes is≤3.0 mg/m<SP>2</SP>on at least one face of the film. COPYRIGHT: (C)2010,JPO&INPIT
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