| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board structure which can reduce the thickness of an entire circuit board structure without providing a core board in the circuit board structure, thus realizing reduction in weight and size, can avoid a trouble of layer separation caused by coupling property failure even if a dielectric layer is put in a clearance between circuits and thereby can improve a wiring density of the circuit board structure, and its production method. <P>SOLUTION: A first circuit layer is formed mainly in a first dielectric layer and the first circuit layer is exposed in a surface of the first dielectric layer, and a second dielectric layer is formed on the first dielectric layer and the first circuit layer, a second circuit layer is formed on the second dielectric layer, and a plurality of first conductive vias to be electrically connected to the first circuit layer are formed in the second dielectric layer. Accordingly, unlike a conventional circuit board, it is not necessary to provide a core board and an electrical plating through hole, thus realizing reduction in weight and size. Furthermore, since the first dielectric layer is liquid before setting and the second dielectric layer is formed on the first dielectric layer before setting, the second dielectric layer is integrally coupled with the first dielectric layer. Consequently, the coupling property of a circuit board interlayer structure is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
