| 摘要 |
A semiconductor device is provided with: a semiconductor integrated circuit element having a plurality of electrode pads; a plurality of first external terminals connected to the electrode pads of the semiconductor integrated circuit element; an inductor arranged in a region surrounded by the first external terminals; and a resin section which seals the element, the terminals and the inductor. The semiconductor integrated circuit element is arranged on the upper surface of the inductor, and the inductor is exposed from the lower surface of the resin section with the first external terminal. |
