| 摘要 |
The purpose of the present invention is to so improve the bonding strength as to be suitable for the increased speed of working even at a low working stage temperature of about 150°C. Bonding wire (P) for connecting an electrode (a) of an integrated circuit element and conductor wiring (c) of a circuit wiring board by means of a ball bonding method. Temper heat treatment is performed to obtain bonding wire having a thickness 0.04 to 0.09µm of a coating layer (2) in such a manner that the coating layer (2) consisting of one or more kinds of gold, platinum, palladium, and silver is formed on the entire outer peripheral surface of a core (1) consisting of copper of not less than 99.99% by mass, that after the adhesion of the core (1) and the coating layer (2) is enhanced by applying diffusion heat treatment to the coated wire thereof, the wire is elongated up to wire diameter L: not less than 12µm and not more than 50.8µm, and further that tensile elongation becomes not less than 8%. The bonding wire with the configuration is connected to the electrode and the conductor wiring with sufficient bonding strength, preventing work from being stopped even under the high-speed work at low temperatures. |
