发明名称 |
ELECTRONIC DEVICE HAVING A PLASTIC SUBSTRATE |
摘要 |
A method of manufacturing a thin-film electronic device comprises applying a plastic coating to a rigid carrier substrate (12) using a wet casting process, the plastic coating forming a plastic substrate (22). The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane. The anisotropy of the thermal expansion in the plastic substrate of the invention enables the expansion of the substrate during the thermal lift-off process to be in the perpendicular direction. This has been found to aid the lift-off process and also protect the components mounted on the upper surface of the plastic substrate.
|
申请公布号 |
US2010196683(A1) |
申请公布日期 |
2010.08.05 |
申请号 |
US20070446477 |
申请日期 |
2007.10.22 |
申请人 |
KONNKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
HASKAL ELIAV ITZHAK |
分类号 |
H01J9/00;B29C41/04;B29C41/22;B32B7/02 |
主分类号 |
H01J9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|