Verfahren zur Herstellung eines Halbleiterbauteils mit Halbleiterchip und Klebstofffolie

摘要

A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.