ADHESIVE FOR ELECTRONIC COMPONENTS

摘要

Provided is an adhesive for electronic components which can prevent the occurrence of warpage of electronic components and the occurrence of reflow cracks even in the case of being used in bonding of thin electronic components. An adhesive for electronic components comprising an epoxy compound having an aliphatic polyether skeleton and a glycidyl ether group, an epoxy group-containing acrylic polymer, an episulfide compound and a curing agent, wherein the content of said episulfide compound is greater than or equal to 1 part by weight and less than 30 parts by weight per 100 parts by weight of said epoxy compound having an aliphatic polyether skeleton and a glycidyl ether group.