| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability in joining of a semiconductor device. <P>SOLUTION: In the semiconductor device 1 in which a wiring pattern 11 on a surface of a base plate 10 is electrically connected with a connecting electrode 3 formed on a connection surface of a semiconductor element 2 and made of a conductive material by face-down packaging, the width of a part of the wiring pattern 11b is set such that a fillet-shaped connecting electrode 3b is formed on the wiring pattern 3b. <P>COPYRIGHT: (C)2010,JPO&INPIT |
