发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition excellent in both of solubility in an organic solvent and a coating property to a support, and also to provide a resist pattern forming method using the positive resist composition. <P>SOLUTION: The positive resist composition is obtained by dissolving in an organic solvent (S) a base component (A) which exhibits increased solubility in an alkali developer under the action of an acid and an acid generator component (B) which generates an acid upon exposure, wherein the component (A) contains a resin component (A1) having four kinds of specific constitutional units, and the component (S) contains 60-99 mass% of an alcoholic organic solvent (S1) and 1-40 mass% of at least one organic solvent (S2) selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, and cyclohexanone. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010170055(A) 申请公布日期 2010.08.05
申请号 JP20090014712 申请日期 2009.01.26
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKESHITA MASARU;YOSHII YASUHIRO;YOKOYA JIRO;SAITO HIROKUNI;NAKAMURA TAKESHI
分类号 G03F7/039;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/039
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