| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting die-bonding film having both a high adhesive force and a storage elastic modulus required for semiconductor device manufacturing, as well as, a dicing-die-bonsinging film equipped with the thermosetting die-bonding film. <P>SOLUTION: This thermosetting die-bonsing film 3 is used for manufacturing a semiconductor device, and includes at least an epoxy resin; a phenol resin; an acrylic copolymer; and a filler with a storage elastic modulus in the range of 10 kPa to 10 MPa prior to thermosetting at 80-140°C; and a storage elastic modulus in the range of 0.1-3 MPa, prior to thermosetting at 175°C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
