发明名称 METHOD OF MANUFACTURING THERMAL TRANSPORT DEVICE, AND THERMAL TRANSPORT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive thermal transport device which is efficiently manufactured in the small number of processes. <P>SOLUTION: In the method of manufacturing the thermal transport device, a capillary member 5 with its thickness thicker than that of a frame member 2 is placed on an inner surface 11 of a lower plate member 1. Then, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and an upper plate member 3 is placed on the capillary member 5. A crushing amount G is provided between the frame member 2 and the upper plate member 3 based on difference between thickness of the capillary member 5 and thickness of the frame member 2. The lower plate member 1 is diffusion-joined to the frame member 2, and the upper plate member 3 is diffusion-joined to the frame member 2. Then, the capillary member 5 is compressed by the crushing amount G. As the capillary member 5 has elasticity, a part of pressure P is absorbed, and pressure P' smaller than the pressure P is applied on the lower plate member 1 from the capillary member 5. The inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-joined by the pressure P'. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010169379(A) 申请公布日期 2010.08.05
申请号 JP20090127374 申请日期 2009.05.27
申请人 SONY CORP;SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 YOSHITAKA HIROYUKI;YAJIMA TAKASHI;ONIKI KAZUNAO;KASAI HIROTO;HIRATA TAKASHI;HASHIMOTO MITSUO
分类号 F28D15/02;B23K20/00;B23K20/26;B23K101/14;H01L23/427 主分类号 F28D15/02
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