| 摘要 |
PROBLEM TO BE SOLVED: To provide the laminated circuit wiring board which is suitable for enhancing the flexibility and reducing the cost by reducing the thickness while having a highly multilayered structure. SOLUTION: The laminated circuit wiring board is formed by laminating first and second circuit wiring boards having a circuit wiring layer formed on the surface of an insulating resin substrate, and a layered printed circuit wiring portion arranged between the first and second circuit wiring boards and formed by printing at least on one surface of the first circuit wiring board, and then pasting the interfaces of lamination by an adhesive layer, wherein the printed circuit wiring portion is equipped with an insulating coating layer which is applied to one surface of the first circuit wiring board to cover the circuit wiring layer and has a contact hole leading to a part of the circuit wiring layer, and a circuit pattern print layer formed by printing conductive paste in the contact hole and over the surface of the insulating coating layer. COPYRIGHT: (C)2010,JPO&INPIT |
