发明名称 |
FORMING METHOD OF CONDUCTIVE THIN FILM |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive thin film for forming a stable conductive thin film comprising metal nano particles on a base material surface in a short time with ease. Ž<P>SOLUTION: The method of forming the conductive thin film includes a step in which the ink containing metal nano particles is applied on a substrate to form a thin film, and a step in which the thin film is acted with reducing agent to perform a reducing process. The metal nano particle containing ink is preferred to contain those in which metal nano particles coated with a protective agent containing alkyl group in straight chain or branch, with carbon numbers being 10-20, are dispersed in nonaqueous dispersion medium. The reducing agent is preferred to be used in the state of water solution of concentration 0.005-0.5 mol/l, and the reducing process to be performed in the temperature condition of 40-70°C. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010171093(A) |
申请公布日期 |
2010.08.05 |
申请号 |
JP20090010521 |
申请日期 |
2009.01.21 |
申请人 |
RISO KAGAKU CORP;UNIV OF TSUKUBA |
发明人 |
OGAWA HIROYUKI;OHASHI KAZUNORI;SHINOZAKI MASAMI;TERANISHI TOSHIJI;KANEHARA MASAYUKI |
分类号 |
H05K3/12;H01B13/00;H01L21/28;H01L21/288;H05K1/09;H05K3/00;H05K3/10 |
主分类号 |
H05K3/12 |
代理机构 |
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