发明名称 FORMING METHOD OF CONDUCTIVE THIN FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive thin film for forming a stable conductive thin film comprising metal nano particles on a base material surface in a short time with ease. Ž<P>SOLUTION: The method of forming the conductive thin film includes a step in which the ink containing metal nano particles is applied on a substrate to form a thin film, and a step in which the thin film is acted with reducing agent to perform a reducing process. The metal nano particle containing ink is preferred to contain those in which metal nano particles coated with a protective agent containing alkyl group in straight chain or branch, with carbon numbers being 10-20, are dispersed in nonaqueous dispersion medium. The reducing agent is preferred to be used in the state of water solution of concentration 0.005-0.5 mol/l, and the reducing process to be performed in the temperature condition of 40-70°C. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010171093(A) 申请公布日期 2010.08.05
申请号 JP20090010521 申请日期 2009.01.21
申请人 RISO KAGAKU CORP;UNIV OF TSUKUBA 发明人 OGAWA HIROYUKI;OHASHI KAZUNORI;SHINOZAKI MASAMI;TERANISHI TOSHIJI;KANEHARA MASAYUKI
分类号 H05K3/12;H01B13/00;H01L21/28;H01L21/288;H05K1/09;H05K3/00;H05K3/10 主分类号 H05K3/12
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