发明名称 METHOD AND DEVICE FOR MOUNTING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide a method of mounting a conductive ball on a substrate with a pad, the method achieving rapid and accurate mounting of the conductive ball on the pad of the substrate by appropriately controlling a ball tossing operation by a container. SOLUTION: The substrate 10 with the pad 14b applied with an adhesive 18 is disposed above a ball holding container 32 which is opened upward with a pad-mounted surface directed downward, the container is moved upward at a predetermined stroke, and the moving speed of the container is decelerated at an acceleration higher than the gravitational acceleration or stopped at the final stage of the up stroke to toss the balls 22 in the container all together to adhere to the adhesive. The container is stopped or moved downward to put balls which does not adhere to the adhesive into the container. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010171147(A) 申请公布日期 2010.08.05
申请号 JP20090011363 申请日期 2009.01.21
申请人 SHINKO ELECTRIC IND CO LTD 发明人 IIDA KIYOAKI;SAKAGUCHI HIDEAKI;TANAKA KAZUO;HIGASHI MITSUTOSHI
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
代理机构 代理人
主权项
地址