| 发明名称 |
BARRIER LAYER TO PREVENT CONDUCTIVE ANODIC FILAMENTS |
| 摘要 |
A through hole is formed in a circuit board (300) that has fibers (312) dispersed in a polymer matrix. Copper is sputtered within the through hole to form a sufficiently conductive layer for electrolytic plating (308) over the sputtered copper layer (306).
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| 申请公布号 |
US2010193229(A1) |
申请公布日期 |
2010.08.05 |
| 申请号 |
US20090366017 |
申请日期 |
2009.02.05 |
| 申请人 |
XILINX, INC. |
发明人 |
ZHANG LEILEI |
| 分类号 |
H05K1/11;H05K1/16;H05K3/10 |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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