| 摘要 |
Provided is a condenser microphone that can reduce the size of a product by disposing a support member over a sound hole of a PCB and mounting a chip on the support member. The condenser microphone includes a micro electro mechanical system (MEMS) chip converting a sound into an electrical signal, a substrate including a sound hole through which the sound is introduced, the MEMS chip being mounted to the substrate, a support member over the sound hole, and a semiconductor chip processing the electrical signal converted through the MEMS chip.
|
