SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device equipped on a semiconductor chip with an aluminum electrode which is processed through direct soldering and wire bonding.

SOLUTION: A fine metal 11 penetrating through an aluminum oxide film 5 up to an aluminum electrode 4 is formed at an appropriate position of the aluminum oxide film 5 on the aluminum electrode 4 in the semiconductor chip 1. Both direct soldering and wire bonding is done in a kind of aluminum electrode with a fine metal penetrating through the oxide.

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