| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve luminance of an LED package structure. <P>SOLUTION: An LED package structure includes a carrier substrate, a reflector and an LED chip. The reflector is disposed on the carrier substrate and includes a base, a magnesium fluoride layer and a cerium dioxide layer. The base has an opening to expose a part of the carrier substrate. The magnesium fluoride layer is disposed on the inside wall of the opening and the cerium dioxide layer is disposed on the magnesium fluoride layer. The LED chip is disposed in the opening and located on the carrier substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
