| 摘要 |
A panel platen for holding substrates such as PCBs has an automatic shimming mechanism to provide shims for panels of varying sizes and/or thicknesses. A platen includes a top surface, and a plurality of adjustable shims located below the top surface and around an edge of the platen, wherein the adjustable shims can be raised and lowered to a desired height to compensate for different sizes or thicknesses of substrates. A platen may include a top surface, a plurality of adjustable height pads located around an edge of the top surface, and a motorized control mechanism located below the top surface and configured to raise and lower the plurality of adjustable height pads. A method of automatically shimming different sized substrates on a platen includes providing a plurality of motorized shims under a top surface of the platen, and raising and lowering the motorized shims based on a size or thickness of a substrate.
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