| 发明名称 |
Integrated Circuit Package |
| 摘要 |
An integrated circuit package includes a digital logic die disposed on a substrate; and an interposer die stacked vertically with the digital logic die on the substrate. The interposer die includes at least one vertical transistor configured to selectively provide electrical power to a portion of the digital logic die.
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| 申请公布号 |
US2010194470(A1) |
申请公布日期 |
2010.08.05 |
| 申请号 |
US20090366234 |
申请日期 |
2009.02.05 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MONCHIERO MATTEO;LEVERICH JACOB B.;RANGANATHAN PARTHASARATHY;JOUPPI NORMAN PAUL;TALWAR VANISH |
| 分类号 |
H01L25/00 |
主分类号 |
H01L25/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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