| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid resin composition which substantially avoids discoloration and reflectance reduction of a white coating film thereof due to exposure to UV and heat history, and which enables to form a pattern at a small light exposure. <P>SOLUTION: The photosensitive resin composition contains: (A) an active energy beam-curable resin having at least two ethylenically unsaturated bonds per molecule; (B) an antioxidant; (C) a photopolymerization initiator; (D) a diluent; (E) titanium oxide; and (F) an epoxy thermosetting compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010169790(A) |
申请公布日期 |
2010.08.05 |
| 申请号 |
JP20090010673 |
申请日期 |
2009.01.21 |
| 申请人 |
TAMURA SEISAKUSHO CO LTD |
发明人 |
KIYOTA TATSUYA;NISHIYAMA HIROYASU;HASEGAWA YASUYUKI;KATAGIRI SHIGEAKI;OKAMOTO YOSHIO |
| 分类号 |
G03F7/038;C08F290/02;C08F290/08;G03F7/004;H05K3/28 |
主分类号 |
G03F7/038 |
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