| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting die bond film superior in wetproof reflow properties and a dicing-die bond film comprising the same by preventing peeling-off and generation of voids between the film and an adherend in a semiconductor package, even when heat treatment is executed at a high temperature for a long time after die bonding. <P>SOLUTION: The thermosetting die bond film 3 is used for manufacturing a semiconductor device, and formed of at least an epoxy resin, a phenol resin, an acrylic copolymer whose weight-average molecular weight is 100,000 or more, and a filler, and the acid number is within the range of 1-4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
