发明名称 SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a technique by which time is suitably determined when a next substrate is to be carried in while suppressing a decrease in efficiency of substrate manufacture. SOLUTION: A substrate processing apparatus 1 acquires heat processing conditions of a substrate W to be processed first by a heat processing section 35, performs heat processing under the processing conditions, and carries the substrate out of the heat processing section 35. When there is a substrate W to be processed next by the heat processing section 35, the substrate processing apparatus 1 acquires heat processing conditions of the next substrate W and determines whether the processing conditions of the first substrate W and the processing conditions of the next substrate W are in a specified combination. When they are in a specified combination, the substrate processing apparatus 1 performs wait processing for making the next substrate W wait at a prescribed position (substrate wait position 34) for a prescribed time. Then a local conveyance mechanism 36 carries the next substrate W in the heat processing section 35 the prescribed time later. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010171266(A) 申请公布日期 2010.08.05
申请号 JP20090013313 申请日期 2009.01.23
申请人 SOKUDO CO LTD 发明人 NAKANO NOBUYUKI;MORITA AKIHIKO
分类号 H01L21/027 主分类号 H01L21/027
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