发明名称 |
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING STRUCTURE |
摘要 |
A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.
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申请公布号 |
US2010193939(A1) |
申请公布日期 |
2010.08.05 |
申请号 |
US20100686590 |
申请日期 |
2010.01.13 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
TAGUCHI YUICHI;SHIRAISHI AKINORI;HIGASHI MITSUTOSHI |
分类号 |
H01L23/48;H01L23/488 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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