PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a means of obtaining both a high heat dissipating property and high flexural strength for a package for electronic element for mounting an electronic element such as a light emitting element and an integrated circuit.

SOLUTION: The package 72 for light emitting element comprises: a base substrate 2 made of ceramic; a frame body 3 made of ceramic arranged on a top surface of the base substrate 2 and provided therein with a cavity 3a for accommodating the light emitting element inside the frame 3; a via 4 formed in the base substrate 2 below the cavity 3a, penetrating the base substrate 2 from the top surface to a bottom surface thereof and filled with a thermally-conductive material 5; and a projecting part 42 formed on an inner wall 41 of the via 4 and projecting toward a center of the via 4. The projecting part 42 has a length L along a direction perpendicular to a penetration direction of the via 4 not less than a thickness T2 along the penetration direction.

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