| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has high reliability of connection with a wiring substrate, and a semiconductor module which has high reliability of connection between a semiconductor substrate and the wiring substrate, and a manufacturing method of the semiconductor module having the high reliability of connection between the semiconductor substrate and wiring substrate. <P>SOLUTION: The semiconductor module includes: the semiconductor device having a plurality of electrodes 14 formed on the semiconductor substrate 10 where an integrated circuit 12 is formed, a resin bump 18 formed on a passivation film 16 and arranged along a first direction, and a plurality of interconnects 20 formed along a second direction orthogonal to the first direction to extend onto the resin bump from on the plurality of electrodes; a plurality of leads formed on a base substrate, arranged opposite the semiconductor device, on its opposite surface, and coming into contact with parts of the interconnects which overlap over the resin bump; and an adhesion layer arranged between the semiconductor device and base substrate, wherein the leads have a width larger than that of the interconnect, and an electric connection portion for an interconnect and an adhesion portion for the resin bump. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
