| 摘要 |
<p>Provided is a method for manufacturing a composite substrate, wherein troubles due to etching can be further suppressed compared with conventional methods wherein thin films are patterned only by etching. The method includes pattern forming steps (S11-S13), an ion implanting step (S14), a bonding step (S15) and a peeling step (S16). In the pattern forming steps (S11-S13), a pattern region (1A) and a reverse pattern region (1B) are formed on the main surface of a functional material substrate (1). In the ion implanting step (S14), a peeling layer (1C) is formed inside at a fixed distance from the surface of the pattern region (1A) and that of the reverse pattern region (1B) by implanting ions into the functional material substrate (1). In the bonding step (S15), the functional material substrate (1) is bonded to a supporting substrate (3) on the pattern region (1A). In the peeling step (S16), the pattern region (1A) is peeled and the reverse pattern region (1B) is peeled and dropped from the functional material substrate (1).</p> |
