| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device suppressing deformation of a semiconductor laser while ensuring excellent heat emission efficiency. SOLUTION: In this semiconductor laser device 1, a semiconductor laser array 11 is jointed to the front end of a body 10A of a heat sink 10, and a pair of pendent parts 10B1, 10B2 are formed on both sides of the front end. An area between the pendent parts 10B1, 10B2 is bridged by a reinforcing member 12. Heat emission in operation is efficiently carried out as compared with the case in which a stress relaxing material is interposed between the heat sink 10 and the semiconductor laser array 11. In a cooling process in jointing, a contraction amount difference due to the difference between a linear expansion coefficient of the heat sink 10 and that of the semiconductor laser array 11 is reduced by the reinforcing member 12, and stress caused by the contraction amount difference is hardly generated in the semiconductor laser array 11. COPYRIGHT: (C)2010,JPO&INPIT |
