| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit wiring board having a minute fine pitch, high dimension accuracy and reliability of bonding between a circuit wiring and an insulating resin layer by preventing the deterioration of dimension accuracy of a wiring having formed pattern which is caused by heat treatment in a process of manufacturing the circuit wiring board. SOLUTION: The circuit wiring board is manufactured by forming a wiring by a direct metallization method and a plating method in a state where a polyimide precursor resin layer formed by applying a polyimide precursor resin solution and drying it is laminated on a metallic sheet-like support member; forming an insulating resin layer by executing heat treatment for the polyimide precursor resin layer to imidize it; and separating the sheet-like support member from the insulating resin layer. COPYRIGHT: (C)2010,JPO&INPIT |
