| 摘要 |
PROBLEM TO BE SOLVED: To provide the apparatus of producing a semiconductor device which can dice a semiconductor wafer into a plurality of semiconductor chips without causing any damage on the semiconductor wafer, and to provide the method of producing a semiconductor device. SOLUTION: The apparatus of producing a semiconductor device includes a table moving apparatus 11 for moving a table 11a in the scheduled dicing direction which is the forward direction for the direction of rotation of a dicing blade 12, and cutting fluid outflow equipment 13 which causes the cutting fluid W to flow out in the scheduled dicing direction for the semiconductor wafer 30 on the table 11a. The semiconductor wafer 30 is diced by pushing the rotating dicing blade 12 to the semiconductor wafer 30 in the cutting fluid W flowing in the scheduled dicing direction. COPYRIGHT: (C)2010,JPO&INPIT |
