| 摘要 |
An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities. The invention relates to an electronic device with integrated discrete components (4), including: a wafer (2), a so-called receiving wafer, said wafer having cavities (5, 5′) containing said components, the active face (10) of which is in a same plane as a face (8) of the receiving wafer, a material (6) for laterally coating the components in the cavities.
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