| 摘要 |
<p>Disclosed is a cleaning agent for copper-wired semiconductors, which exhibits high removal performance of organic residuals (benzotriazole and quinaldic acid) formed during a polishing step, while having high suppressing effect on corrosion of copper wiring. The cleaning agent also exhibits excellent removal performance of metal residuals on an insulating film. Specifically disclosed is a cleaning agent for copper-wired semiconductors, which contains, as indispensable components, an organic amine (A), a quaternary ammonium compound (B), a specific polyvalent hydroxyl group-containing compound (C), at least one hydroxycarboxylic acid (D) selected from the group consisting of hydroxytricarboxylic acids and hydroxytetracarboxylic acids, and water (W).</p> |
