| 摘要 |
<p>Disclosed is an alignment method that is able to align a band-shaped substrate with a pattern member, on which the pattern to be exposed onto this substrate has been disposed, with high precision. An alignment method aligns a band-shaped substrate (FB) with a pattern member, on which the pattern to be exposed onto said substrate (FB) has been disposed. This alignment method comprises a step wherein first data, related to the relative positions of a reference member (95), on which a stage device that holds and moves the substrate (FB) is disposed, and a pattern member, are detected via a through-hole (TH) disposed on the substrate (FB), a step wherein second data, related to the position of an alignment mark (AM) disposed on the substrate (FB), are detected, a step wherein third data, related to the relative positions of the sensor that detects the position of the alignment mark (AM) and the reference member (95), are detected via the through-hole (TH), and a step wherein the stage device is driven based on the first, second, and third data.</p> |
