| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame of a resin-encapsulated device improved so as to prevent trouble in which a chip element mounted on a die pad peels by skillfully preventing the die pad form being affected by bending stress generated due to bending of a terminal lead. <P>SOLUTION: The lead frame of the resin-encapsulated device is obtained through: a step in which a lead frame 1 obtained by pattern-forming the die pad 1a and the terminal lead 1b connecting with the die pad, is insert-molded in a resin case 2; a step in which a peripheral region of the chip element (LED chip 3) mounted on the die pad 1a is encapsulated with an encapsulating resin 5; and a step of lead processing in which an outer lead part of the terminal lead 1b led sideways from the resin case 2 is bent at its root. In the lead frame, an anchor hole 1c is formed in the inner lead part of the terminal lead 1b, and the terminal lead 1c is locked and fixed to the resin case 2 through an anchor part 2a of the molding resin filled into the anchor hole 1c in the insert molding. <P>COPYRIGHT: (C)2010,JPO&INPIT |
