| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure and a MEMS relay, by which transmission loss of high-frequency signals can be reduced and which can be fabricated easily. SOLUTION: The wiring structure includes a base 20 composed of a substrate, a transmission line 10 formed on one surface side of the base 20, a ground line 11 arranged at the surrounding of the transmission line 10 and electrically insulated from the transmission line 10, and a first hole 24 and a second hole 25 respectively installed on one end side and the other end side in the width direction of the transmission line 10 so as to pinch the transmission line 10, and formed to be penetrating through the base 20 in the width direction. The ground line 11 has a first conductive part 110 formed inside the first hole 24, a second conductive part 111 formed inside the second hole 25, and a third conductive part 112 formed on the other surface side of the base 20 and connected to the first conductive part 110 and the second conductive part 111. Respective holes 24, 25 are formed so that the length along the width direction of the transmission line 10 becomes larger on the other surface side than that on one surface side. COPYRIGHT: (C)2010,JPO&INPIT |
