发明名称 Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith
摘要 An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A).
申请公布号 US2010196808(A1) 申请公布日期 2010.08.05
申请号 US20090311235 申请日期 2009.01.07
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 MIZUSHIMA AYAKO;MAKABE HIROAKI;TAKEDA NAOSHIGE
分类号 G03F7/004 主分类号 G03F7/004
代理机构 代理人
主权项
地址