| 摘要 |
There is provided a process for manufacturing an electronic device, comprising an electronic component (a light receiving unit 11 and a base substrate 12 on which is placed the light receiving unit 11) and a substrate (a transparent substrate 13) which face each other and an adhesion layer 15, which bonds the electronic component to the substrate, containing a resin composition containing a photocurable resin, comprising forming the resin composition constituting the adhesion layer on the substrate or the electronic component; selectively exposing the resin composition with a light and developing the resin composition to form the frame-shaped adhesion layer in a predetermined region; placing the adhesion layer between the electronic component and the substrate; heating the electronic component, the substrate and the adhesion layer to a predetermined temperature, in the course of which the electronic component and the substrate are pressure-bonded through the adhesion layer; maintaining the pressure-bonding state of the electronic component, the substrate and the adhesion layer at the predetermined temperature; and cooling the electronic component, the substrate and the adhesion layer. |
