发明名称 DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a double-faced adhesive film which sufficiently suppresses deformation and warping upon heating. <P>SOLUTION: The double-faced adhesive film 1 includes a support film 10, a first adhesive layer 21 laminated on one face of the support film 10, and a second adhesive layer 22 laminated on the other face of the support film 10, wherein the glass transition temperatures after curing of the first and second adhesive layers 21 and 22 are 100°C or lower, the glass transition temperature after curing of the first adhesive layer 21 is higher by 10°C or higher than the glass transition temperature after curing of the second adhesive layer 22, and the support film 10 has a coefficient of linear expansion of 100 ppm or lower. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010168513(A) 申请公布日期 2010.08.05
申请号 JP20090014296 申请日期 2009.01.26
申请人 HITACHI CHEM CO LTD 发明人 KATAYAMA YOJI;KIMURA KOICHI;NAKAMURA YUKI;MIYAHARA MASANOBU;KITAKATSU TSUTOMU
分类号 C09J7/02;C09J11/04;C09J201/00 主分类号 C09J7/02
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