发明名称 LASER BEAM APPLYING DEVICE AND LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a technology capable of transmitting a laser beam having desired power from a body part to a laser beam head part while avoiding any complication of a structure of the laser beam head part, in a laser beam applying device having constitution in which the body part and the laser beam head part are separated from each other and in a laser beam machining apparatus having the laser beam applying device. <P>SOLUTION: A laser beam machining apparatus 100 including the laser beam applying device comprises a laser beam control unit 110 for emitting the laser beam, a laser beam head part 120, and a laser beam transmitting unit 130 including optical fiber for transmitting the laser beam emitted from the laser beam control unit 110 to the laser beam head part 120. The laser beam transmitting unit 130 includes optical fiber 11A for transmitting the laser beam without substantially amplifying the laser beam, and optical fiber 11B for amplifying the laser beam. The length of the transmission line of the laser beam from the terminating end of the optical fiber 11B to the laser beam head part 120 is determined so as not to substantially cause any stimulated scattering beam in the transmission line. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010167433(A) 申请公布日期 2010.08.05
申请号 JP20090011141 申请日期 2009.01.21
申请人 OMRON CORP 发明人 NAKANO FUMIHIKO;KAWADA SHOHEI;ISHIZU YUICHI;YOSHIOKA MASAO
分类号 B23K26/08;B23K26/00 主分类号 B23K26/08
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