| 摘要 |
PROBLEM TO BE SOLVED: To provide a means where a MEMS device and IC chip are easily integrated in wafer processing without forming a through electrode or side electrode, while securely sealing the MEMS device and IC chips integrally. SOLUTION: The MEMS device and IC chip are electrically and physically connected, and a post-electrode and post-electrode component with wirings connected thereto are connected on a wiring layer of a surface of the MEMS device or the IC chip. The post-electrode component with wirings are configured by forming the post-electrode and wirings connected thereto on a support plate. The wirings are exposed by peeling the support plate after resin sealing to connect an electrode for external connection to the other end portion of the wiring connected to the post-electrode. COPYRIGHT: (C)2010,JPO&INPIT
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